Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Login or REGISTER Hello, {0}. 9 signal pairs/inch and can be used down to 25 mm card slot pitch. 4, 6 or 8 columns. EN. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. If you use the QSFP transceivers in the QSFP28 100G port, keep in mind that you have both single-mode and multimode (SR/LR) optical transceivers and Twinax/AOC options that are. Buy 923400E40H - Amphenol Communications Solutions - Connector, 8 Col x 4 Diff Pair, XCede HD Series, 1. These connectors are two-piece devices that connect two printed circuit boards. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. English. The XCede ® HD Plus backplane connector achieves high . Contact us today for more details of XCede HD, part number 970301YD2B. 85 Ω and 100 Ω options. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 1. 1 DOCUMENTS 2. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Customer Measurement Report: FCI XCede® Connector. Three levels of sequencing enable hot plugging. The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Connections hint for November 24. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office. Check Pricing. 2. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. 2. You previously purchased this product. DC Connector Configurations XCede HD connector system. Login or REGISTER Hello, {0}. Formed in 2020 by a merger of three well. These connectors are available in 3-, 4- and 6-Pair configurations. The XCede ® I/O connector supports next generation 100G+ applications and. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. DETAILS. XCede Connectors are available at Mouser Electronics. Description Initial Date “-“ S1188 Initial Release T. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. SERIES Maximum signal pins Terminal pin orientation Connector Length Type Termination Row REMARKS; HM2A30: 6 Spl: Vertical: 50. Login or REGISTER Hello, {0}. Standard or high-speed wafers available. 2. Advanced Search. Available for SOLIDWORKS, Inventor, Creo, CATIA, Solid Edge, autoCAD, Revit and many more CAD software but also as STEP, STL, IGES, STL, DWG, DXF and more neutral CAD formats. Offering a linear density of up to 84 differential pairs per inch and can. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®. This document is intended to serve as an application guide for designing the XCede HD connector system into various customer system configurations. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. 54 - 5. 2. We believe that unlocking the potential of our workforce through outstanding training, earnings potential and reward structures is key to Xcede’s success. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contact Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. The connectors are intermatable, electrically and mechanically interchangeable. 6. XCede HD achieves the highest performance in an HM compatible form factor. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. ExaMAX® 2. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Features. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. 7mil Drill Minimum Pad Size vs. 2-to-PCIE-x4 adapter cable - but it runs $150. 0” Long. Amphenol XCede High Speed / Modular Connectors are available at Mouser Electronics. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. 6amps per mm. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. F X Connectors in Victoria, reviews by real people. Get the best deals on Amphenol Backplane Connectors Connectors when you shop the largest online selection at eBay. 7. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. 6 %âãÏÓ 2647 0 obj > endobj 2677 0 obj >/Encrypt 2648 0 R/Filter/FlateDecode/ID[65646E18716E2B4991C9C621A98364C7>]/Index[2647 447]/Info 2646 0 R/Length 155. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. for connector repairability. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Español $ USD United States. VVG-Befestigungstechnik GmbH & Co. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. 2. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. 00mm: 2 - 54: 1. Nashua, NH, February 2, 2009– Amphenol TCS, the leading provider of high performance backplane interconnect systems, today announced two additions to the XCede® connector platform – XCede 85 Ohm and XCede cables and assemblies. was founded in 1987 with the mission of becoming a specialty connector manufacturer, delivering highest quality products and providing unparalleled customer service. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Backwards mating compatible with XCede ® HD connector. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. TARGET MARKETS. 00 mm contact wipe on signal pins. This specification covers the performance, test, and quality requirements for the XCede HD Plus backplane interconnect system. The XCede ® HD Plus backplane connector achieves high . Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Back. 80mm Right-Angle Backplane Receptacle (HDTF). . Choice of 2 or 4 power banks. Other items. Accessories; Audio Products; CapacitorsAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. . 2 mm, Receptacle, Press Fit, 2 Rows. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in mind. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed / Modular Connectors. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The series offers mechanical. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or. XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. 80 mm High-Density Backplane Right-Angle Receptacle. XCede Product Family Connector Press-fit Installation Process . View in Order History. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. 0 DEFINITIONS 4. XCede. . 3. Male SMA connectors have a center pin and inner threads whereas female SMA connectors have. RAM Steel Beam Design calculates the number of studs required, accounting for the locations of maximum moments and zero moments and special distributions required due to the presence of point loads. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 4、6或8列. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed/Modular Connectors. Login or REGISTER Hello, {0}. 1. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. 63. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card. Revision SCR No. Vertical or Right Angle. 2. High-density backplane system – up to 84 differential pairs per linear inch. XCede® HD 1. Available with 40, 60 and 80 signal pins. XCede ® HD2 §Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. The PCIe bus, NC-SI bus, SMBus interface, various other sideband signals, and power are assigned to this connector. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 6. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. 12 - 48 pairs. 1. ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede HD achieves the highest performance in an HM compatible form factor. Amphenol is one of the leading manufacturers of Connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. XCede® connectors also address. EN. Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. c-jx410-51594 a creo files jx410-51594_bp . An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card connector or. 1. XCede High Speed/Modular Connectors are available at Mouser Electronics. performance (up to 28+ Gb/s) in a Hard Metric form factor. XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Amphenol solves system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, and computer server markets. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2 The daughtercard connector building blocks include signal modules, power modules, guidance/polarizing modules and grounded guidance modules that are all assembled to a metal organizer (stiffener). The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Secured form. screw length and part number are dependent on daughtercard thickness (as specified from configurator). KK connector systems are customizable for a variety of power and signal applications. 2-, 3-, 4-, 5-, 6-Pair configurations. 4. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. Amphenol is one of the leading manufacturers of Backplane connectors. Wille Dodge Chrysler Jeep Ram, Victoria, British Columbia. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA. See section 4 regarding XHD+ RAM connectors. TARGET MARKETS. 60mm (. Shear Stud Connectors. 1. Welcome to Wille Dodge, a family-owned dealership with 44 years of. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. Board-to-board connector / right-angle / female The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Contact Mouser (USA) (800) 346-6873 | Feedback. Contact Mouser (USA) (800) 346-6873 | Feedback. Rugged Edge Rate® contact system. 1. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. PCIe ® (peripheral component interconnect express) is an interface standard for connecting high-speed components in a computer or server. 4 FMC+ VITA 74 VNX适用于密度关键型应用的小型高密度背板系统，采用模块化设计并提供可选功能，以提升灵活性和实现可定制解决方案。XCede® BACKPLANE CONNECTOR SYSTEM - FCI. These connectors are two-piece devices that connect two printed circuit boards. § Differential pairs 28-84 per inch (11-33 differential pairs perBack view of 24 x 2. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall 高速背板系统. During this. Once the XCede connector standoff features begin to come in contact with the PWB surface, the force vs. 2. 2. Login or REGISTER Hello, {0}. 00mm pitch (FF5026) and 050mm pitch (FF3025). Connector, XCede HD Series, 100 Contacts, 1. XCEDE CONNECTOR ECCN / UNSPSC / COO. Dislaime Please note that the above information is subject to change without notice. 1. signal connector (J_BP_SIG) 5. 7mil Drill Minimum Pad Size vs. 2. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactJ-Tech, Inc. Features. SIMM was one of the earliest multichip memory modules used in PCs, generally with 30pins and 70pins, and a 32–bit data path. Description. Environmental Compliance. See Figure 15 for details. Contact us today for more details of XCede HD, part number 968-4200-A1H. - FCI. Login or REGISTER Hello, {0}. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. For a 4-pair differential connector per column, 54. Complementary guide and power modules are also included in the product range. 4, 6 or 8 columns. Basically, it is how all major components inside a computer talk with each other. XCEDE® BACKPLANE CONNECTOR SYSTEM XCEDE® POWER SYSTEM 150 grams normal force nominal POWER RATING Modular construction gives an effective current density of 8. 2. XCede ® HD and XCede ® HD Plus, this connector provides . Send us a Message. For optimal connector configuration, connectors are grouped into signal modules of 4,. 0177" drill, nano ni, std gold 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank. Buy 10113949-L0E-20DLF - Amphenol Communications Solutions - Connector, FCI XCede Series, 32 Contacts, Header, Press Fit, 8 Rows. My main workstation is based on Ryzen 7 5800X, Asus Crosshair VIII Dark Hero, 64 GB RAM, 1TB Samsung 980 PRO SSD, EVGA RTX 3070ti FTW3 GPU, etc. Three levels of sequencing enable hot plugging. 5. Brand of Product：Amphenol ICC,Part#：946-200X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. XCede® Stacker. Revision “F” Specification Revision Status . element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. 1K+ bought in past month. The SMA (or Sub-Miniature A) connector has a 50Ω impedance and can handle frequencies up to 17 GHz. FCI released XCede vertical backplane headers and right-angle daughter card receptacles designed for 25 Gb/s performance. Free shipping on many items | Browse your favorite brands | affordable prices. No spam. 6. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. Features. 2. 9 signal pairs per inch are. Distance Graph showing two shapes of the knee area utilizing an 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. Change Location. Rugged Edge Rate® contact system. XCede High Speed / Modular Connectors are available at Mouser Electronics. Find Parts Learn More. Distance Curve of MEP-12T press for XCede and XCede Plus connectors. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. 08mm. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. Español $ USD United States. Connectors; High Speed Board-to-Board; Micro Pitch Board-to-Board; Rugged / Power; Edge Card; Backplane / Micro Backplane; Standard Board-to-Board; Industry Standards;. XCede® HD 1. Yelp is a fun and easy way to find, recommend and talk about what’s great and not so great in Victoria and beyond. a SFP+ adapter that's super-short 3. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA RATES UP TO 14 GBPS. XCedeHD RAM and XCede HD Inverted RAMrefer to. We chose the Asus Prime X470-Pro for its inclusion of many modern. 00 mm High-Speed Backplane Cable Socket. XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. FEATURES. performance (up to 28+ Gb/s) in a Hard Metric form factor. 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2. Figure 14: Typical Force vs. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Integrated power and guidance. DDR-SDRAM stands for Double Data Rate - Synchronous Dynamic Random Access Memory and it is a common type of memory used-organized RAM in most of the processors. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. The series offers mechanical longevity and ruggedness, guidance and keying options, and. 3. 00 mm的触点滑动范围. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. English. Backwards mate compatibility. 4. Daugtercard connectors feature Amphenol’s integral stiffener which allows designersXCede ® High-Performance Backplane Connector System. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission and. 2. DC connector configurations are determined by the customers’ system application. 2 The daughtercard connector building blocks include signal modules, power modules,. Formed in 2020 by a merger of three well. FEATURES. 高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。. XCede ® HD is a small form factor system with a modular design for significant space savings and. 8 mm column pitch representing a 35% increase versus XCede®. Integrated guidance, keying and polarizing side walls available. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. 3. high speed performance, paddle card edge connector series for next Gen. {{metaDescription}} FCI’s XCede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card. Nov 13, 2019. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co -planar applications. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. Data rates capable up to 28 Gb/s to support system upgrades without costly redesigns. 7. XCede HD achieves the highest performance in an HM compatible form factor. Up to 3. Submit a Brief. The system’s. 5 - Effective capacity assumes average 4:1 data reduction. XCede ® HD Plus. 1. power connector (J_PWR_B) 7. Integrated power, guidance, keying and side walls available. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. RF Connectors Valcon IPEX Type RF Samtec Bulls Eye® RF Samtec Ganged RF. Login or REGISTER Hello, {0}. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 11. Revision SCR No. Available in industry-standard 2. challenging architectures. XCede® connectors also address. 1. We would like to show you a description here but the site won’t allow us. 1 DOCUMENTS 2. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Login or REGISTER Hello, {0}. 0225" Drill Compliant Pin Protrusion (mm) (negative numbers result in no protrusion) 0. Power blades rated up to 60 A per power bank. TARGET MARKETS. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82 differential pairs/inch. Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. We offer interconnection systems from 2. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Description. BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. XCede® connectors also address. Search. They are available in 1. XCede HD achieves the highest performance in an HM compatible form factor. Two press-fit sizes, (standard and small) provide board layout options for designers. XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). These modules consist of a 12. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or OIF CEI-6G, CEI-11G, CEI-28G. Skip to content. The. 3. Scalable upgrades to 56Gb/s without costly redesigns. DETAILS. 28 Figure 15: XCede pressing Force vs. Typically, XCede compliant pins will require an insertion force of 2-10 lbs/pin. XCede® connectors also address. 00mm pitch (FF5026) and 050mm pitch (FF3025). Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . 使用Samtec的高速板对板Solutionator®构建您的对接连接器套件 。. Login or REGISTER Hello, {0}. Up to 3. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. DETAILS. Applications. 2.